Ultra-Fast Picosecond Cold Processing · Non-Destructive Precision Engraving
Adopting picosecond-level ultra-fast laser technology, it acts instantaneously on the material surface to achieve zero thermal damage processing, eliminating burnt edges, discoloration, carbonization and other defects. It perfectly preserves the original material properties and greatly improves product yield.
Micron-Level Precision · Extreme Edge Quality
Equipped with high-precision linear motors and CCD automatic positioning system the positioning accuracy reaches ±2μm. The cutting edges are smooth and flat free of burrs, chipping and micro-cracks, meeting the strict requirements of precision manufacturing.
Full Material Compatibility · Versatile Empowerment
Compatible with a full range of brittle and flexible materials including glass sapphire, ceramic, silicon wafer, FPC, ultra-thin metal and composite materials One machine handles multi-scenario processing, suitable for 3C electronics, semiconductor, new energy and other fields.
Non-Contact Intelligent Manufacturing · Stable & Long-Lasting Performance
Non-contact processing mode produces no mechanical stress or tool wear, avoiding secondary material damage. Supported by a marble bed, it features strong shock resistance and excellent processing consistency, ideal for long-term large-scale mass production.
High-Efficiency Automation · Cost Reduction & Efficiency Improvement
High-speed motion platform with intelligent control system supports graphic import auto-focus and batch processing, greatly improving cutting efficiency compared with traditional equipment. The long-life laser design requires no consumables reducing operation and maintenance costs.
Green Precision · Quality Upgrade
Dust-free, waste liquid-free and cutting fluid-free, complying with environmental protection production standards. It can accurately realize special-shaped cutting micro-hole processing and fine pattern engraving, unlocking new possibilities for high-end precision manufacturing.
Ultra-Fast Picosecond Cold Processing · Non-Destructive Precision Engraving
Adopting picosecond-level ultra-fast laser technology, it acts instantaneously on the material surface to achieve zero thermal damage processing, eliminating burnt edges, discoloration, carbonization and other defects. It perfectly preserves the original material properties and greatly improves product yield.
Micron-Level Precision · Extreme Edge Quality
Equipped with high-precision linear motors and CCD automatic positioning system the positioning accuracy reaches ±2μm. The cutting edges are smooth and flat free of burrs, chipping and micro-cracks, meeting the strict requirements of precision manufacturing.
Full Material Compatibility · Versatile Empowerment
Compatible with a full range of brittle and flexible materials including glass sapphire, ceramic, silicon wafer, FPC, ultra-thin metal and composite materials One machine handles multi-scenario processing, suitable for 3C electronics, semiconductor, new energy and other fields.
Non-Contact Intelligent Manufacturing · Stable & Long-Lasting Performance
Non-contact processing mode produces no mechanical stress or tool wear, avoiding secondary material damage. Supported by a marble bed, it features strong shock resistance and excellent processing consistency, ideal for long-term large-scale mass production.
High-Efficiency Automation · Cost Reduction & Efficiency Improvement
High-speed motion platform with intelligent control system supports graphic import auto-focus and batch processing, greatly improving cutting efficiency compared with traditional equipment. The long-life laser design requires no consumables reducing operation and maintenance costs.
Green Precision · Quality Upgrade
Dust-free, waste liquid-free and cutting fluid-free, complying with environmental protection production standards. It can accurately realize special-shaped cutting micro-hole processing and fine pattern engraving, unlocking new possibilities for high-end precision manufacturing.
I. Consumer Electronics
Precision cutting of sapphire protective sheets and glass lenses for mobile phone cameras
Processing of ultra-thin glass, ceramic covers and special-shaped structural parts for mobile phones/tablets
High-precision cutting of watch cases, lenses and ceramic components for smart wearables
II. Display & Optics
Cutting and drilling of optical glass, quartz glass and optical filters
Micro-machining of Mini/Micro LED substrates and wafer-level glass
Processing of ultra-thin glass (UTG) and film materials for OLED/flexible screens
III. PCB & Flexible Electronics
Depaneling and special-shaped cutting of FPC flexible circuit boards and rigid-flex boards
High-precision cutting of cover films, PI films and LCP films
Carbon-free machining of micro-grooves, blind grooves and special-shaped holes for PCBs
IV. Semiconductors & Ceramic Substrates
Cutting/drilling of alumina, aluminum nitride and zirconia ceramic substrates
Precision dicing and cutting of silicon wafers, SiC wafers and glasswafers
Micro-machining for semiconductor packaging,RF devices and power devices
V. Ultra-thin Metal Precision Machining
Cutting of ultra-thin metal foils/sheets including stainless steel, copper aluminum and molybdenum
Machining of precision gaskets, shielding components, sensor springs and micro-electrodes
Burr-free, deformation-free and heat-affected zone-free edge processing
VI. New Energy & Medical Devices
High-speed precision cutting of lithium battery electrodes, separators and packaging films
Processing of medical microfluidic chips, implantable devices and precision medical components
